Roger R. Schmidt, PhD

IBM Fellow, Data Center Efficiency
IBM

Dr. Roger R. Schmidt, IBM Fellow, National Academy of Engineering Member, IBM Academy of Technology Member and ASME Fellow, has over 30 years experience in engineering and engineering management in the thermal design of IBM’s large scale computers. He has led development teams in cooling mainframes, client/servers, parallel processors and test equipment utilizing such cooling mediums as air, water, and refrigerants. He has published more than 100 technical papers and holds over 100 patents/patents pending in the area of electronic cooling. He is a member of ASME’s Heat Transfer Division and an active member of the K-16 Electronic Cooling Committee. He has been an Associate Editor of the Journal of Electronic Packaging and an Associate Editor of the ASHRAE Research Journal and is now an Associate Editor of the ASME Journal of Heat Transfer. He has taught extensively over the past 25 years Mechanical Engineering courses for prospective Professional Engineers and has given seminars on electronic cooling at a number of universities. He is a past Chair of the ASHRAE TC9.9 committee on Mission Critical Facilities, Technology Spaces, and Electronic Equipment.